Equipment Name: Special Optical Chip Die Bonder

The specialized optical chip bonder is a dedicated automated equipment designed to meet the high-precision, high-reliability bonding and assembly requirements of special optical chips (such as optical communication chips, laser chips, infrared detection chips, quantum optical chips, etc.). It integrates micron-level positioning, flexible process control, and optical performance collaborative testing. These chips typically feature "optical function sensitivity, high structural fragility, and stringent bonding precision requirements" (e.g., laser chips require an optical axis alignment deviation ≤1μm, quantum chips need to avoid bonding stress affecting quantum states). The core value of the equipment lies in addressing the challenge of "simultaneous optical performance and mechanical assembly assurance," which manual labor or general bonders cannot meet, thereby supporting the mass production of specialized chip devices in high-end fields like optical communications, laser technology, quantum technology, and medical imaging.

I. Core Functions and Workflow

The equipment is designed around the entire process of "special chip characteristic adaptation—high-precision positioning alignment—optical function-compatible bonding—multi-dimensional quality verification," with a focus on breakthroughs in "collaborative control of optical parameters and assembly precision." The specific workflow is as follows:

Customized material loading and preprocessing

Specialized Chip Loading: Customized modules tailored to chip forms (e.g., TO-packaged laser chips, bare optical communication chips, thin infrared chips). Bare chips utilize "vacuum suction + anti-static protection" (suction cup made of conductive silicone to prevent electrostatic damage to chip circuits). TO-packaged chips are positioned and grasped via an indexing plate, with pin recognition modules confirming orientation. Certain quantum chips/superconducting optical chips require loading in an inert gas-protected chamber (to prevent oxidation or contamination from air).

Substrate/Carrier Loading: Substrate types include ceramic substrates (high thermal conductivity), sapphire substrates (high light transmittance), and silicon substrates (compatible with integrated circuits). Pre-fixed via linear modules + positioning pins, some scenarios require integrated plasma cleaning/laser cleaning modules to remove nanoscale surface contaminants (avoiding impact on adhesion or optical reflectivity). If pre-dispensing is needed, non-contact jet dispensing valves are equipped (dispensing accuracy ±3%, minimum dispensing volume ≤0.001μL), suitable for micro-sized chip bonding areas.

Material Error Prevention and Identification: Dual verification via "vision + barcode/QR code scanning" ensures chip model and batch compatibility with substrates (e.g., optical communication chips must match specific wavelength indicators). Simultaneously, chip appearance is inspected (e.g., scratches on laser chip emission zones, contamination on infrared chip photosensitive areas), with defective materials identified and removed in advance.

Multi-Dimensional High-Precision Alignment (Core Technology) Different from general pick-and-place machines, it requires simultaneous achievement of "mechanical positioning" and "optical reference alignment" to ensure the optical performance of bonded chips meets standards:

Mechanical Positioning: Utilizing "dual cameras + telecentric optical system + piezoelectric ceramic drive," the chip side identifies pads, reference Mark points, or package edges, while the substrate side aligns with bonding area Mark points, conductive traces, or optical windows. The positioning accuracy reaches **±0.10.5μm** (repeatability ±0.050.2μm), meeting the micron-level assembly requirements for laser chips and quantum chips.

Optical Reference Alignment (Special Feature): For optically sensitive chips, a dedicated alignment module is integrated—for laser chip bonding, "auxiliary laser emission + optical power detection" confirms alignment between the chip's optical axis and the substrate's optical channel (deviation ≤0.5μm); for infrared detector chip bonding, "infrared illumination + photosensitive imaging" aligns the photosensitive area with the substrate circuit; for quantum chip bonding, "atomic force microscope (AFM)-assisted positioning" is employed to avoid mechanical contact damage to quantum structures.

Dynamic Compensation: A high-speed motion control card (response delay ≤0.5ms) receives real-time deviation data from both "mechanical positioning" and "optical reference" dimensions, driving the bonding head to perform micro-adjustments across X/Y/θ/Z axes while compensating for substrate thermal deformation (coordinates are corrected in real-time via temperature sensors).

Optical Function-Compatible Bonding: The bonding process must avoid damaging the optical functionality of the chip (e.g., the emission zone of laser chips or the superconducting structures of quantum chips). The key lies in "flexible pressure + precise temperature control + optical interference avoidance":

Flexible Pressure Control: Utilizing "piezoelectric sensors + servo closed-loop control," the pressure range is adjustable from 0.01 to 10N (accuracy ±0.005N). For fragile chips (e.g., GaN-based laser chips), a "progressive pressure loading" approach is adopted (gradually increasing from 0.01N to the set value over 0.5–2s) to prevent chip cracking or pad detachment. For quantum chips, "vacuum-assisted bonding" (without direct pressure) is employed to avoid stress-induced instability in quantum states.

Precise Temperature Control: Equipped with "micro-heating bonding heads + infrared temperature measurement modules," the temperature control range spans 25–300°C (accuracy ±0.5°C). Two modes are supported:   - **Thermocompression bonding** (e.g., eutectic soldering for optical communication chips and ceramic substrates, requiring 200–280°C).   - **Low-temperature bonding** (e.g., quantum chips and superconducting substrates, requiring ≤50°C to prevent superconducting performance degradation).   Thermal isolation design prevents heat conduction to the chip's optical functional areas.

Optical Interference Avoidance: Bonding heads use "low-reflectivity materials" (e.g., black-anodized aluminum) to minimize reflection-induced interference during optical inspections. For photosensitive chips (e.g., infrared detectors), the loading and bonding zones are equipped with "anti-glare shields," allowing only specific wavelength light (e.g., 850nm near-infrared) for positioning.

Multi-Dimensional Inspection & Sorting: Post-bonding verification includes both "mechanical assembly quality" and "optical functional performance" to prevent defective products from entering downstream processes.

Mechanical inspection: The vision system identifies chip offset (with an out-of-tolerance threshold set to ≤0.3μm), adhesive layer bubbles (defective if diameter ≥0.05mm), and pad disconnections (detected via AOI automated optical inspection).

Optical Function Testing (Core Feature): Integrated specialized testing modules—after laser chip bonding, the laser output power (deviation ≤5%) and wavelength stability are tested using a "light power meter + spectrometer"; infrared chips are tested for response uniformity of the photosensitive area with an "infrared imager"; optical communication chips are tested for signal transmission loss (≤0.1dB) with an "optical insertion loss tester".

Automatic Sorting: Qualified products are transported to the next process (such as packaging, aging tests) via an "inert gas-protected conveyor belt" (for oxidation-prone chips), while defective items are sorted by an anti-static robotic arm into dedicated waste bins. Defect types (e.g., "optical axis deviation," "power failure") are recorded, and process parameters are linked to facilitate traceability and optimization.

II. Core Advantages

"Optical + Mechanical" Dual-Precision Collaborative Control

Breaking through the limitation of general-purpose placement machines that focus solely on mechanical positioning, "optical reference alignment + mechanical precision compensation" ensures the optical functionality of chips meets standards post-bonding (e.g., laser chip optical axis alignment deviation ≤ 0.5μm, optical communication chip signal loss ≤ 0.1dB). This addresses the industry pain point of "mechanical assembly passing but optical function failing," improving yield rates by 20%~40% compared to general-purpose equipment.

Deep Customization for Specialized Chip Characteristics

Material Compatibility: Customized anti-static, anti-oxidation, low-stress bonding solutions (such as inert gas protection, vacuum pressure-free bonding) tailored for special chip materials like GaN, InP, and superconducting materials.

Process Flexibility: Supports various techniques including eutectic bonding, UV adhesive bonding, ACF conductive adhesive bonding, and adhesive-free vacuum adsorption. Through modular switching (such as replacing bonding heads or adding/removing inspection modules), it adapts to chip requirements across fields like optical communication, lasers, and quantum technology.

High Stability and Low Loss

Low-Damage Design: The "gradual pressure + low-impact motion" approach reduces breakage rates of specialty chips from 3%~8% on general equipment to below 0.1%.

Environmental Control: Optional modules include temperature and humidity control (23±2°C, 50±5% RH), dust prevention (Class 100 cleanroom standard), and inert gas protection, meeting stringent environmental demands for quantum chips, superconducting optical chips, etc.

Full-Process Intelligence and Traceability

Equipped with a dedicated "Optical Chip Mounting Management System," its core functionalities include:

Optical Parameter Linkage Control: Correlate optical detection data (e.g., optical power, wavelength) with bonding process parameters (pressure, temperature) to automatically optimize parameters (e.g., fine-tuning the thermal compression temperature when optical power is low);

Full Data Traceability: Record the entire chain of data from "material information - positioning data - process parameters - optical test results," supporting QR code-based traceability for individual chip production processes;

Remote Operation and Maintenance: Features fault diagnosis and remote parameter adjustment to reduce on-site maintenance costs and ensure continuous production in high-end production lines.

III. Typical Application Scenarios

High-End Optical Communication Chip Sector

100G/400G/800G optical module chip bonding: For bonding applications such as silicon photonic chips and VCSEL (Vertical-Cavity Surface-Emitting Laser) chips with ceramic substrates, it is necessary to ensure an optical axis alignment deviation of ≤0.5μm and signal transmission loss of ≤0.1dB. The equipment achieves simultaneous bonding and performance assurance through "assisted laser alignment + optical insertion loss detection."

Coherent optical communication chip bonding: For applications such as bonding modulator chips to fiber array substrates, it is necessary to control the bonding stress (to avoid modulation performance drift). The equipment adopts a "low pressure (0.05~0.1N) + constant temperature (25±1°C)" bonding solution.

Laser and infrared detection field

High-power laser chip bonding: For bonding applications such as GaN-based blue laser chips and Yb:YAG solid-state laser chips to copper-tungsten heat dissipation substrates, eutectic soldering (260~280°C) is employed to enhance heat dissipation efficiency. The equipment requires temperature control accuracy of ±0.5°C and pressure control of ±0.01N to prevent thermal damage to the chips.

Infrared focal plane array (FPA) chip bonding: For bonding applications such as mercury cadmium telluride (HgCdTe) infrared chips to readout circuit substrates, precise alignment between the photosensitive area and the circuit (deviation ≤0.3μm) must be ensured. The equipment utilizes "infrared imaging alignment + adhesive-free conductive bonding" to prevent the adhesive layer from affecting infrared transmittance.

Quantum technology field

Quantum Optical Chip Bonding: For processes like bonding silicon-based quantum dot chips or superconducting qubit chips to superconducting substrates, operations must be conducted under inert gas protection (purity ≥99.999%), low temperature (≤50°C), and stress-free conditions. The equipment employs "vacuum adsorption bonding + AFM-assisted alignment" to prevent stress from affecting quantum state stability.

Quantum Communication Chip Bonding: For bonding single-photon detector chips to optical window substrates, optical transmittance (≥95%) must be ensured. The equipment integrates a "real-time transmittance monitoring module" to simultaneously track transmittance changes during the bonding process.

High-End Optical Applications in Medical and Industrial Fields

Medical Imaging Device Chip Bonding: For bonding scintillator chips in PET-CT to photoelectric conversion chips, positioning deviation must be ≤0.2μm (to prevent image blurring). The equipment achieves high-precision alignment through "dual telecentric cameras + AOI inspection."

Industrial LiDAR Chip Bonding: For bonding VCSEL array chips to optical lens substrates, laser beam collimation (deviation ≤0.5μm) must be ensured. The equipment uses a "laser beam analysis module" to adjust bonding positions in real time, guaranteeing beam direction compliance.

IV. Customer Value and Service Guarantee

Full Lifecycle Service Assurance

Pre-sales Service: Offer free technical consultations and customize exclusive inspection solutions based on the client's filter type, detection requirements, and production line layout.

During-sales Service: Provide free installation, debugging, and operator training (theory + hands-on) upon equipment arrival to ensure the client's team can operate independently.

After-sales Service: Includes 1-year free warranty and 24/7 remote technical support (covering major industrial cities nationwide).

Value-added Services: Equipment maintenance guidance, long-term support for customer production line optimization.

V. Contact Us

Company Name: Guangzhou Hailei Automatic Control Technology Co., Ltd.

Detailed Address: Unit 801D, Building 8, No. 638 Shishun Avenue, Shitan Town, Zengcheng District, Guangzhou

Mobile: Mr. Lai 13924066971

Miss Yang 15989558269

For customized equipment solutions or parameter manuals, feel free to contact us anytime! We will arrange professional technical engineers to provide one-on-one service for you!