Equipment Name: High-Speed Optical Filter Mounting Machine

The high-speed optical filter mounting machine is a core automated equipment in fields such as optical communication, consumer electronics, and automotive electronics. It is specifically designed for high-speed, high-precision assembly of optical filters (such as WDM filters, infrared filters, narrowband filters, and polarizing filters) onto substrates (PCBs, ceramic substrates, glass substrates, metal carriers) or optical components (such as lens modules, optical module housings). Its core value lies in addressing the pain points of manual filter mounting, including low efficiency, significant positioning deviations, and susceptibility to damage (filters are typically thin, fragile, high-precision optical components). By integrating high-speed transmission, micron-level visual positioning, flexible pressure bonding, and online inspection technologies, it ensures the optical performance (such as transmittance, isolation, and polarization consistency) and structural stability of the mounted filters, supporting the mass production of optical devices, lens modules, and other products.

I. Core Functions and Workflow

The equipment is designed around the entire process of "high-speed material transfer - precise positioning alignment - flexible bonding - quality inspection," with core focus on balancing "high speed" and "high precision." The detailed workflow is as follows:

Material Loading and Preprocessing

※ Customized loading modules: Tailored for crystal dimensions (ranging from millimeter to centimeter scale) and forms (sheet, block, or thin flexible crystals), offering tray-based loading (for regular crystals), vacuum nozzle loading (for thin/fragile crystals), or vibratory bowl feeding (for small standardized crystals). Substrate/carrier loading typically employs belt conveyors or robotic arm transfer, with some models integrating substrate cleaning modules (e.g., plasma cleaning, dust-free wiping) to remove surface oil/dust, preventing bonding adhesion or optical performance issues.

※ Material identification and error prevention: Uses visual pre-positioning or barcode scanning to verify crystal model, orientation (e.g., optical axis direction), and substrate compatibility, avoiding process waste due to material mismatches.

High-precision dual-vision positioning

Alignment, as the core process of the equipment, must achieve micron-level precision in both "crystal positioning" and "substrate positioning" to ensure bonding accuracy:

※ Crystal-side positioning: High-magnification industrial CCD (equipped with telecentric lenses and coaxial lighting) captures crystal contours, edges, fiducials (e.g., notches, indentations), or optical axis markers to calculate deviations (X/Y-axis offset, rotation angle) between actual and theoretical positions;

※ Substrate-side positioning: Simultaneously identifies bonding area markers (e.g., fiducial marks, pad outlines) on the substrate to correct placement misalignment;

※ Dynamic compensation: The vision system transmits deviation data in real-time to the motion control system, driving the bonding head for X/Y/θ-axis adjustments with positioning accuracy reaching ±0.5~3μm (higher precision ≤±1μm required for laser/optical communication applications).

Process execution of lamination (core process)

The bonding head, as the execution core, requires customized design based on crystal characteristics and bonding requirements (such as the presence of adhesive layers or the need for thermal compression). Key process controls include:

Pressure control: Utilizing piezoelectric sensors or servo motor drives to achieve adjustable pressure output ranging from 0.05 to 50N. For brittle crystals (such as lithium niobate), a "soft contact" mode (low pressure + slow speed) is adopted to prevent edge chipping or cracking. Temperature control (optional configuration): If thermally cured adhesives (such as epoxy) or anisotropic conductive films (ACF) are used, the bonding head is equipped with a built-in heating module with a temperature range of 50–200°C and a control accuracy of ±1°C to ensure full adhesive curing without damaging the crystal's optical properties. Adhesive layer control (optional configuration): Some models integrate dispensing modules (such as jet dispensing valves) to precisely apply adhesive in the substrate bonding area (adhesive volume error ≤ ±5%) or accommodate pre-coated substrates, ensuring uniform adhesive thickness (avoiding bubbles or localized adhesive deficiency).

Pressing, Curing, and Shaping (Optional)

For scenarios requiring enhanced bonding stability, the equipment can integrate subsequent processing modules:

Pressing Module: Utilizes roller pressing (suitable for elongated crystals) or flat-plate pressing (suitable for sheet-like crystals), applying uniform pressure (0.1~10N) to eliminate adhesive layer bubbles and enhance bonding strength;

Curing Module: Configure a UV curing lamp (for UV adhesives) or a constant-temperature curing chamber (for thermal-curing adhesives) based on the adhesive type, achieving an integrated "lamination - pressing - curing" process to avoid secondary misalignment during material transfer.

Online Inspection and Sorting

After lamination, multi-dimensional inspection ensures product quality:

Appearance Inspection: The vision system identifies defects such as crystal breakage, edge chipping, adhesive layer bubbles, and excessive misalignment.

Optical Performance Testing (High-end Models): Equipped with an integrated spectrometer or laser interferometer to sample and test optical parameters such as transmittance, polarization state, and phase difference after crystal bonding (e.g., laser output efficiency for laser crystal assemblies);

Sorting action: Qualified products are conveyed to the next process (such as packaging or cutting), while defective products are automatically sorted into the waste bin with defect types recorded (e.g., "crystal edge chipping" or "excessive offset"), supporting subsequent process parameter optimization.

II. Core Advantages

Balancing High Speed and High Precision

Utilizing "linear motor + high-speed vision" technology, the placement speed can reach 300~800 pieces/hour (10~20 times more efficient than manual operation), while maintaining a positioning accuracy of ±0.3~1μm. This not only meets mass production capacity demands but also ensures the optical performance of filters (e.g., no channel isolation drift in WDM filters after placement), addressing the industry pain point of "high-speed placement leading to accuracy degradation."

Flexibility and Low Loss

Pressure Control: "Progressive Pressure" + "Customized Suction Cups" (e.g., micro suction cups for filters below 2mm×2mm), reducing filter breakage rates from manual operation's 8%~15% to below 0.2%;

Process Adaptation:

Supports multiple processes such as adhesive-free bonding (e.g., laser welding-assisted), UV adhesive bonding, and ACF bonding. Through modular switching (e.g., replacing the bonding head, adding/removing dispensing/curing modules), it can adapt to different types of filters without requiring a full machine replacement.

High Compatibility and Extensibility

Compatible with various specifications of filters and substrates:

Filter size: 0.5mm × 0.5mm ~ 50mm × 50mm (covering micro to medium-large filters);

Substrate types: PCB, ceramic, glass, metal, flexible FPC;

Supports multi-station expansion (e.g., upgrading from 2 to 4 stations) or adding functional modules like online optical inspection and automatic dispensing to accommodate future capacity or process upgrades.

Intelligence and Traceability

Equipped with dedicated mounting management software, core features include: Smart Recipes: One-click parameter switching (pressure, speed, temperature) for different products, with changeover time ≤5 minutes;

Data Monitoring:

Real-time display of production capacity, yield rate, and defect distribution (such as bubble ratio, offset ratio), supporting PDF/Excel report export; Abnormal Warning: When pressure anomalies, material shortages, or positioning failures occur, the equipment automatically stops and pops up an alarm, while recording abnormal data for quick troubleshooting;

MES Integration: Upload production data to enterprise management systems to achieve full-process traceability of "material - process - finished product," meeting the quality control requirements of high-end manufacturing.

III. Typical Application Scenarios

Optical Communication Field (Core Scenario)

WDM Filter and Optical Module Substrate Bonding: Used in 5G/6G communication optical modules (e.g., 100G/400G LR4 optical modules), where DWDM/CWDM filters need to be bonded to ceramic or metal substrates. The equipment must achieve positioning accuracy of ±0.5μm (to avoid channel crosstalk) and a bonding speed of ≥500 pieces/hour (to match the mass production needs of optical modules).

Polarizing filter and fiber assembly bonding: Used in optical isolators and circulators, ensuring alignment between the filter's polarization direction and the fiber, requiring equipment with an integrated polarization direction recognition vision module.

Consumer electronics sector

Laser crystal (e.g., Nd:YAG, Yb:YAG) bonding with heat dissipation substrates: For high-power lasers, enhancing thermal efficiency through high-temperature pressing processes, requiring equipment capable of 150~200°C temperature control and 5~10N pressure output; Sapphire crystal and optical lens bonding: For high-end camera lenses and LiDAR windows, ensuring post-bonding optical transmittance (avoiding adhesive layer bubbles or misalignment affecting light transmission), requiring equipment with integrated online optical inspection modules.

Automotive electronics field

Lidar filter and optical component bonding: For autonomous driving lidar (such as solid-state lidar), large-size filters (≥20mm×20mm) need to be bonded, requiring equipment to support high-pressure bonding (5~10N) to enhance structural stability (withstand in-vehicle vibration environments);

Vehicle-mounted camera IR filter bonding: Must meet automotive-grade reliability (-40~85℃ operating conditions), with the equipment's temperature control module precisely regulating thermo-compression temperature (120~150℃) to ensure long-term resistance of the adhesive layer to high and low temperatures.

Industrial and Medical Optics

Industrial camera filter lens bonding: Used for machine vision inspection equipment, it is essential to ensure the optical resolution after filter lens bonding (avoiding misalignment that leads to blurred imaging), with a required positioning accuracy of ≤±0.3μm.

Optical filter lamination for medical imaging equipment: Used in optical modules of CT and MRI devices, requiring adhesive-free lamination processes (to avoid volatiles from adhesive layers affecting equipment cleanliness), with the need to integrate laser welding or vacuum adsorption fixation modules.

IV. Customer Value and Service Assurance

Full Lifecycle Service Assurance

Pre-sales service: Provide free technical consultation and customize exclusive testing solutions based on the customer's filter type, testing requirements, and production line layout.

After-sales service during sales: After the equipment arrives, we provide free installation and debugging, as well as operator training (theory + hands-on) to ensure the customer's team can operate independently;

After-sales service: We offer a 1-year free warranty and 24/7 remote technical support (covering major industrial cities nationwide);

Value-added services: Equipment maintenance guidance and long-term support for customer production line optimization.

V. Contact Us

Company Name: Guangzhou Harley Automatic Control Technology Co., Ltd.

Detailed Address: Room 801D, Building 8, No. 638 Shishun Avenue, Shitan Town, Zengcheng District, Guangzhou

Mobile: Mr. Lai 13924066971

Miss Yang 15989558269

For customized equipment solutions or parameter manuals, feel free to contact us anytime. Our professional technical engineers will provide you with one-on-one service!